Heat dissipation apparatus for electronic device
US8238102B2 · kind B2 · utility
7Cited by
24References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2010 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Oct 27, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation apparatus adapted for cooling an electronic component received in a metal housing includes a heat sink thermally attached to the electronic component and a plurality of resilient tabs arranged between the heat sink and the metal housing. The resilient tabs are elastically deformed by the metal housing and thermally contact an inner face of the metal housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.