Cap for MEMS package
US8238107B2 · kind B2 · utility
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1References
5Claims
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Key dates
| Filing date | Feb 26, 2010 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Nov 21, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/00888
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A cap for a MEMS package includes a main body having a bottom surface, a top surface, a plurality of accommodations recessed from the bottom surface towards the top surface, and a plurality of slots recessed from the top surface towards the bottom surface in a way that the top surface is defined into a plurality of regions corresponding to the accommodations respectively. After completion of the MEMS package, the package can be cut along the slots into a plurality of MEMS package units, such that the cutting work can be done quickly and the cutting burrs can be minimized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.