Electronic module with vertical connector between conductor patterns
US8238113B2 · kind B2 · utility
5Cited by
11References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2010 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Feb 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention generally relates to a new structure to be used with electronic modules such as printed circuit boards and semiconductor package substrates. Furthermore there are presented herein methods for manufacturing the same. According to an aspect of the invention, the aspect ratio of through holes is significantly improved. Aspect ratio measures a relationship of a through hole or a micro via conductor in the direction of height divided width. According to the aspect of the invention, the aspect ratio can be increased over that of the prior art solution by a factor of ten or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.