Patent · US Active

Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer

US8240032B2 · kind B2 · utility

12Cited by

58References

20Claims

0Family size

Assignee

Imbera Electronics Oy · FI

Inventors

Antti Iihola · Helsinki, FI
Timo Jokela · Halikko, FI
Petteri Palm · Regensburg, DE
Risto Tuominen · Espoo, FI

Key dates

Filing date	Jun 13, 2005
Grant date	Aug 14, 2012
Priority date	—
Expiry date	Mar 15, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49169
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Method for manufacturing an electronic module, which electronic module includes a component (6), which is connected electrically to a conductor-pattern layer (14). In the method contact openings (17) are made in the conductor layer (4), the mutual positions of which correspond to the mutual positions of the contact areas (7) of the component (6). After this, the component (6) and the conductor layer (4) are aligned relative to each other, in such a way that the contact areas (7) of the component (6) come to the positions of the contact openings (17), and the component (6) is secured. After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is made that connects the component (6) to the conductor layer (4). After the making of the contact the conductor layer (4) is patterned to form a conductor-pattern layer (14).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.