Patent · US Active

Method for manufacturing a circuit board

US8240033B2 · kind B2 · utility

4Cited by

59References

21Claims

0Family size

Assignee

Imbera Electronics Oy · FI

Inventors

Risto Tuominen · Espoo, FI
Antti Iihola · Helsinki, FI
Petteri Palm · Regensburg, DE

Key dates

Filing date	Jun 15, 2006
Grant date	Aug 14, 2012
Priority date	—
Expiry date	Feb 21, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49158
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern (13) is made, and contact openings are made in it for a component's (16) electrical contacts. After this, the component (16) is attached relative to the conductor pattern (13), in such a way that the contact areas or contact bumps of the component lie next to the contact openings. After this, an electrically conductive material is introduced to the contact openings, in order to form electrical contacts between the conductor pattern (13) and the component (16).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.