Methods for minimizing component shift during soldering
US8240545B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2011 |
| Grant date | Aug 14, 2012 |
| Priority date | — |
| Expiry date | Aug 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/2908
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods for minimizing component shift during soldering are described. One such method includes forming a pedestal pad having a preselected shape on a substrate, forming at least one intervening layer on the substrate, the at least one intervening layer including a layer including a solidifying accelerant, and a layer including a solder, the solder layer having a preselected shape about the same as the preselected shape of the pedestal pad, positioning the component on the at least one intervening layer, and heating the solder to a predetermined process temperature, wherein the pedestal pad is configured to remain a solid during the heating the solder to the predetermined process temperature, and wherein the solidifying accelerant is configured to accelerate a solidification of the solder after the heating the solder to the predetermined process temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.