Patch panel assembly and patching module thereof
US8241055B2 · kind B2 · utility
11Cited by
5References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 26, 2009 |
| Grant date | Aug 14, 2012 |
| Priority date | — |
| Expiry date | Jan 13, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/515
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A patch panel assembly and a patching module thereof are described. The patch panel assembly includes an outer frame and more than one patching module disposed on the outer frame. The patching module includes a registered jack (RJ) component and an insulation displacement contact (IDC) component which can be combined correspondingly, so that a plurality of RJ jacks and a plurality of IDC pins are electrically connected and assembled on the outer frame. The IDC component can further match two specifications of punch down tools to perform compression and wire bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.