Thermally conductive, electrically insulating composite film and stack chip package structure utilizing the same
US8242372B2 · kind B2 · utility
1Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2010 |
| Grant date | Aug 14, 2012 |
| Priority date | — |
| Expiry date | Nov 17, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because the film has thermal conductivity and electric insulation properties, it can be disposed between the chips of a stack chip package structure, thereby dissipating the heat in horizontal and vertical directions simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.