Encapsulation, MEMS and method of selective encapsulation
US8242569B2 · kind B2 · utility
3Cited by
5References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 25, 2009 |
| Grant date | Aug 14, 2012 |
| Priority date | — |
| Expiry date | Jun 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/1057
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An encapsulation of a sensitive component structure on a semiconductor substrate with a film covering the component structure is disclosed. A cavity for the component structure is provided in the film. A MEMS and a method for encapsulating a sensitive component structure is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.