Patent · US Active

Electronic component with diffusion barrier layer

US8242599B2 · kind B2 · utility

0Cited by

4References

19Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Richard Fix · Gerlingen, DE
Oliver Wolst · Walzbachtal, DE
Alexander Martin · Regensburg, DE

Key dates

Filing date	Jan 9, 2008
Grant date	Aug 14, 2012
Priority date	—
Expiry date	Oct 11, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

An electronic component is described that includes a metallic layer on a substrate that is made of a semiconductor material and a diffusion barrier layer that is made of a material that has a small diffusion coefficient for the metal of the metallic layer which is formed between the metallic layer and the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.