Method of utilizing a solder reflow channel in the formation of a hard disk drive
US8243395B2 · kind B2 · utility
0Cited by
19References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2008 |
| Grant date | Aug 14, 2012 |
| Priority date | — |
| Expiry date | May 11, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/4806
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of utilizing a solder reflow channel in the formation of a hard disk drive is disclosed. The method provides a first hard disk drive component having at least one solder reflow channel, the at least one solder reflow channel for retaining a predeposited solder material. The solder reflow channel is utilized to provide a solder location for coupling the first hard disk drive component and a second hard disk drive component to the predeposited solder material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.