Method of adjusting wafer processing sequence

US8244500B2 · kind B2 · utility

Assignee

• Inotera Memories, Inc. · TW

Inventors

• Yun Tian · Ames, US
• Chun-Chi Chen · San Diego, US
• YI FENG LEE · Daxi District, TW
• Wei-Jun Chen · Zhejiang, CN
• Shih Chang Kao
• YIJ CHIEH CHU · New Taipei, TW
• Cheng-Hao Chen · Taipei, TW

Key dates

• Filing date: Jun 2, 2009
• Grant date: Aug 14, 2012
• Expiry date: Feb 19, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P90/02
• WIPO field: Control
• WIPO sector: Instruments

Abstract

A method of adjusting wafer process sequence includes steps of collecting production parameters for a plurality of lots; selecting a plurality of key parameters from the production parameters, wherein the key parameters at least includes a processing sequence; defining a formula to obtain an epsilon value; categorizing the lots into groups according to the epsilon value and the minimum point number by using density-based spatial clustering of application with noise (DBSCAN); and adjusting the processing sequences of the lots in the groups. Thereby, the lots with the same process recipe can be continuously or simultaneously sent into a machine, thereby reducing replacement of process recipes or shortening machine idle time.