Knowledge-based models for data centers
US8244502B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2009 |
| Grant date | Aug 14, 2012 |
| Priority date | — |
| Expiry date | Oct 15, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20836
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Techniques for data center analysis are provided. In one aspect, a method for modeling thermal distributions in a data center is provided. The method includes the following steps. Vertical temperature distribution data is obtained for a plurality of locations throughout the data center. The vertical temperature distribution data for each of the locations is plotted as an s-curve, wherein the vertical temperature distribution data reflects physical conditions at each of the locations which is reflected in a shape of the s-curve. Each of the s-curves is represented with a set of parameters that characterize the shape of the s-curve, wherein the s-curve representations make up a knowledge base model of predefined s-curve types from which thermal distributions and associated physical conditions at the plurality of locations throughout the data center can be analyzed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.