Laser assisted frit sealing of high CTE glasses and the resulting sealed glass package
US8245536B2 · kind B2 · utility
2Cited by
3References
23Claims
0Family size
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Key dates
| Filing date | Nov 24, 2008 |
| Grant date | Aug 21, 2012 |
| Priority date | — |
| Expiry date | Dec 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2101/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A laser assisted frit sealing method is described herein that is used to manufacture a glass package having a first glass plate (with a relatively high CTE of about 80-90×10−7° C.−1), a second glass plate, and a frit (with a CTE that is at least about 35×10−7° C.−1), where the frit forms a seal (e.g., hermetic seal) which connects the first glass plate to the second glass plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.