Method for assembling an optoelectronic device
US8246867B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2009 |
| Grant date | Aug 21, 2012 |
| Priority date | — |
| Expiry date | Jul 29, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/8722
Abstract
Methods for assembling an optoelectronic device are provided. The optoelectronic device includes a first transparent substrate, a second substrate, and environmentally sensitive components. The methods comprise the step of applying a fill material to a surface of at least one of the substrates, and lowering a viscosity of the fill material. The methods further comprise the step of pressing the first transparent substrate and the second substrate together such that the fill material substantially fills an area between the first transparent substrate and the second substrate and substantially encapsulates exposed portions of the environmentally sensitive components. The methods still further comprise the step of sealing the first transparent substrate and the second substrate together to hermetically seal the fill material within the area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.