Patent · US Active

Method of molding a microneedle

US8246893B2 · kind B2 · utility

23Cited by
59References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 16, 2011
Grant dateAug 21, 2012
Priority date—
Expiry dateMar 16, 2031

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29L2031/756
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A method of molding a microneedle using a mold apparatus that includes the use of high frequency acoustic energy, such as ultrasonic energy.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.