Injection molding method
US8246895B2 · kind B2 · utility
0Cited by
12References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2006 |
| Grant date | Aug 21, 2012 |
| Priority date | — |
| Expiry date | Apr 24, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2705/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Molding methods and systems are disclosed for manufacturing molded items (10) with an integral substrate (50) formed thereon, particularly wherein the substrate has a metallic appearance and/or wherein the molded product is formed with a geometric feature (66) associated with an edge of the substrate adapted for at least partially obscuring the edge in the molded product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.