Method of manufacturing LED module
US8247247B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2010 |
| Grant date | Aug 21, 2012 |
| Priority date | — |
| Expiry date | Jan 26, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing an LED module, including steps of: providing a heat conductive plate and an LED die, the heat conductive plate defining a concave groove therein; forming an electrode circuit layer on the heat conductive plate around the concave groove; plating one metal layer on a bottom of the concave groove of the heat conductive plate, and plating another metal layer on the LED die; eutectically bonding the metal layer of the heat conducting plate and the metal layer of the LED die together to form into an eutectic layer; forming electrodes on the LED die, and connecting the electrodes with the electrode circuit layer; and encapsulating the LED die in the concave groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.