Method for the production of an optoelectronic component using thin-film technology

US8247259B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Vincent Grolier · Birkenfeld, DE
• Andreas Plössl · Regensburg, DE

Key dates

• Filing date: Nov 21, 2008
• Grant date: Aug 21, 2012
• Expiry date: Nov 21, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/018

Abstract

On an epitaxy substrate (1), a layer structure (5, 6, 7) provided for light-emitting diodes or other optoelectronic components using thin-film technology is produced and provided with a first connecting layer (2), which comprises one or a plurality of solder materials. A second connecting layer (3) is applied over the whole area on a carrier (10) and permanently connected to the first connecting layer (2) by means of a soldering process.