Methods for printing an ink on a textured wafer surface
US8247312B2 · kind B2 · utility
2Cited by
21References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2008 |
| Grant date | Aug 21, 2012 |
| Priority date | — |
| Expiry date | Jul 19, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of printing an ink on a wafer surface configured with a set of non-rounded peaks and a set of non-rounded valleys is disclosed. The method includes exposing the wafer including at least some non-rounded peaks and at least some of the non-rounded valleys in a region to an etchant. The method further includes depositing the ink on the region, wherein a set of rounded peaks and a set of rounded valleys are formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.