Method of forming micropattern, die formed by this method of forming micropattern, transfer method and micropattern forming method using this die
US8247330B2 · kind B2 · utility
2Cited by
1References
11Claims
0Family size
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Key dates
| Filing date | Mar 6, 2008 |
| Grant date | Aug 21, 2012 |
| Priority date | — |
| Expiry date | Oct 24, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micropattern is joined to a substrate (W1) by: a first group of covering step and micropattern forming step by etching in a transfer step; and a second group of covering step and micropattern forming step by etching in the transfer step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.