Motherboard interconnection device
US8247704B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 15, 2009 |
| Grant date | Aug 21, 2012 |
| Priority date | — |
| Expiry date | Apr 12, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A motherboard interconnection device includes a top layer, a bottom layer, a first and a third electronic elements positioned on the top layer, and a second and a fourth electronic elements positioned on the bottom layer. A first end of the first electronic element on the top layer is connected to the first end of the second electronic element on the bottom layer with a first via hole, and the first end of the third electronic element on the top layer is connected to the first end of the fourth electronic element on the bottom layer with a second via hole. The second ends of the two electronic elements on the top layer are connected to a first part, and the second ends of the two electronic elements on the bottom layer are connected to a second part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.