Patent · US Active

Laser scribing and machining of materials

US8247731B2 · kind B2 · utility

4Cited by
12References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 30, 2008
Grant dateAug 21, 2012
Priority date
Expiry dateApr 26, 2031

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB23K26/16
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

Disclosed are systems and methods for directing laser energy to surfaces of materials via elements which have sharp points, and for reducing the adverse effects of particles which become dislodged by scribing and laser machining of materials.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.