Laser scribing and machining of materials
US8247731B2 · kind B2 · utility
4Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2008 |
| Grant date | Aug 21, 2012 |
| Priority date | — |
| Expiry date | Apr 26, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed are systems and methods for directing laser energy to surfaces of materials via elements which have sharp points, and for reducing the adverse effects of particles which become dislodged by scribing and laser machining of materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.