Chip package structure including heat dissipation device and an insulation sheet
US8247891B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2009 |
| Grant date | Aug 21, 2012 |
| Priority date | — |
| Expiry date | Aug 31, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip package structure including a substrate, at least one chip, a plurality of leads, a heat dissipation device, a molding compound, and at least one insulating sheet is provided. The chip is disposed on the substrate. The leads are electrically connected to the substrate. The molding compound having a top surface encapsulates the chip, the substrate, and a portion of the leads. The heat dissipation device is disposed on the top surface of the molding compound. The insulating sheet disposed between the heat dissipation device and at least one of the leads has a bending line dividing the insulating sheet into a main body disposed on the molding compound and a bending portion extending from the main body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.