RFID tag and manufacturing method thereof
US8248240B2 · kind B2 · utility
28Cited by
1References
4Claims
0Family size
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Key dates
| Filing date | Jul 29, 2008 |
| Grant date | Aug 21, 2012 |
| Priority date | — |
| Expiry date | Feb 20, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An RFID tag includes an inlay which has a base, an antenna formed on the base, and an IC chip. The IC chip is enclosed in a surface mount package and soldered to the antenna and carries out radio communication through the antenna. The RFID tag further includes underfill that fills a gap between the base and the surface mount package, and a sheath protecting material enclosing the entire inlay.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.