Heat sink type module
US8248786B2 · kind B2 · utility
6Cited by
6References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 21, 2010 |
| Grant date | Aug 21, 2012 |
| Priority date | — |
| Expiry date | Nov 2, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink type module includes a mounting seat and a heat sink. The mounting seat includes a supporting plate, and two substantially parallel first side plates extending up from opposite first sides of the supporting plate. A latch protrudes from an inner surface of each first side plate. A heat sink includes a base plate and fins extending up from a top surface of the base plate. The base plate includes two substantially parallel first sides. The latches of the first side plates latch the first sides of the base plate to fix the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.