Method for repairing motherboard
US8250722B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Oct 22, 2009 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Dec 22, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4975
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is utilized for repairing a motherboard with a defective dual inline memory module (DIMM) socket mounted thereon be surface mounted technology (SMT). The method includes following steps. Repair tools including a ball grid array (BGA) rework device, a steel bar, a nozzle, and a steel sheet are provided. The BGA rework device, the nozzle are align with the defective DIMM on the motherboard for heating up solder balls between the defective DIMM and the motherboard until the solder balls are melted. The defective DIMM is removed from the motherboard. The steel bar is installed on a replacement DIMM to detect a planarity of a bottom face of the replacement DIMM. The replacement DIMM is mounted on the motherboard to replace the defective DIMM if the replacement DIMM is qualified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.