Communications device with integrated case temperature measurement
US8251582B2 · kind B2 · utility
0Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2012 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Feb 6, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K1/16
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A communications device with integrated case temperature measurement includes a case having at least one thermally conductive wall and a circuit board at least partially disposed within the case. At least one electronic component is mounted on the circuit board and a temperature sensor is mounted on the circuit board. At least one thermally conductive protrusion extends from the wall and is thermally coupled to the temperature sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.