Camera module and method for fabricating the same
US8251601B2 · kind B2 · utility
4Cited by
1References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 21, 2010 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Dec 29, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a camera module and a method for fabricating the same. A camera module includes an image sensor device chip having a plurality of solder balls on a bottom surface thereof. An optical lens is disposed on the image sensor device chip. A metal plate has a part that extending over the bottom surface of the image sensor device. A metal coating layer surrounds vertical surfaces of the optical lens and a top surface of the part of the metal plate. A first light shielding layer covers vertical surfaces of the metal coating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.