Structured abrasive article, method of making the same, and use in wafer planarization
US8251774B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2009 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Jun 25, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A structured abrasive article comprises an at least translucent film backing and an abrasive layer disposed on the backing. The abrasive layer comprises a plurality of shaped abrasive composites. The shaped abrasive composites comprise abrasive particles dispersed in a binder. The abrasive particles consist essentially of ceria particles having an average primary particle size of less than 100 nanometers. The binder comprises a polyether acid and a reaction product of components comprising a carboxylic(meth)acrylate and a poly(meth)acrylate, and, based on a total weight of the abrasive layer, the abrasive particles are present in an amount of at least 70 percent by weight. Methods of making and using the structured abrasive article are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.