Bonded abrasive tool and method of forming
US8252075B2 · kind B2 · utility
4Cited by
11References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 22, 2009 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Apr 7, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonded abrasive tool includes a bonded abrasive body having a bond matrix material comprising an organic bond material, abrasive grains contained within the bond matrix material, and not greater than about 5 vol % chopped fiber bundles within the bond matrix material. The tool further has a porosity within the bonded abrasive body, wherein a majority of the porosity comprises pores surrounding the chopped fiber bundles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.