Automatic feed system and related process for introducing source material to a thin film vapor deposition system
US8252117B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2010 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Jan 9, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F71/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A feed system and related process are configured to continuously feed measured doses of source material to a vapor deposition apparatus wherein the source material is sublimated and deposited as a thin film on a substrate. The system includes a bulk material hopper, and an upper dose cup disposed to receive source material from the hopper. A lower dose cup is disposed in a vacuum lock chamber to receive a measured dose of source material from the upper dose cup. A transfer mechanism is disposed below the vacuum lock chamber to receive the measured dose of source material from the lower dose cup and to transfer the source material to a downstream deposition head while isolating the deposition conditions and sublimated source material within the deposition head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.