Layout method of bridging electrode
US8252151B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Mar 24, 2010 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Feb 26, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/0446
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In a layout method of a bridging electrode, the method includes the steps of: providing a substrate; forming a transparent electro-conductive layer on the substrate and the transparent electro-conductive layer having a plurality of neighboring patterned blocks; forming an alignment film layer on the substrate and the alignment film layer having a plurality of bridging grooves of a bridging insulation unit crossing between the patterned blocks; forming an electro-conductive layer on the substrate and the electro-conductive layer having a plurality of wires respectively disposed on the bridging grooves, wherein the wires of the electro-conductive layer being formed through an optical compensation mask in conjunction with at least one of over-exposure and over-development; and forming a protection layer on the substrate to enhance optical transmission and to protect the substrate, the transparent electro-conductive layer, the alignment film layer and the electro-conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.