Bonding wood composites with resin solids-fortified phenol-formaldehyde resin
US8252427B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Apr 15, 2011 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Apr 15, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31989
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention comprises an aqueous phenol-formaldehyde resole resin liquid fortified with powdered (e.g., spray dried) phenol-formaldehyde resole resin, preparing wood composites, particularly oriented strand board (OSB), waferboard, particleboard, medium density fiber board, and hardboard, using the solids-fortified liquid resin, and related wood composites bonded with the solids-fortified resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.