Hot melt compositions
US8252506B2 · kind B2 · utility
6Cited by
18References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2009 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Sep 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Hot melt compositions include acid waxes and acrylate functional monomers free of acid groups. Upon application of actinic radiation, the hot melt compositions cure to form and etch resist. The hot melt compositions may be used in the manufacture of printed circuit boards, optoelectronic and photovoltaic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.