Patent · US Active

Carbon nanotube-based horizontal interconnect architecture

US8253249B2 · kind B2 · utility

0Cited by

4References

17Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventor

Jean Dijon · Le Pont-de-Claix, FR

Key dates

Filing date	Mar 27, 2009
Grant date	Aug 28, 2012
Priority date	—
Expiry date	Jan 8, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/01058
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a device which makes it possible to establish a horizontal electrical connection between at least two bonding pads. This device comprises horizontal carbon nanotubes which link the vertical walls of said bonding pads and the bonding pads are made by stacking layers of at least two materials, one of which catalyzes growth of the nanotubes and the other of which acts as a spacer between the layers of material which catalyzes growth of the nanotubes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.