Integrated electrical circuit and test to determine the integrity of a silicon die
US8253420B2 · kind B2 · utility
3Cited by
19References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2009 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Nov 17, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2884
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A detection circuit and one or more wires or circuit traces are included in a die. The combination is used to detect mechanical failure of the substrate, e.g. silicon after singulation of the dice from the wafer. Failures may be detected at different regions or planes within the die, and the tests may be performed during operation of the packaged die and integrated circuit, even after installation and during operation of a larger electronic device in which it is incorporated. This is especially useful for chip scale packages, but may be utilized in any type of IC package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.