Circuit board testing using a probe
US8253430B2 · kind B2 · utility
1Cited by
17References
38Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 14, 2008 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Jan 31, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A test point of a circuit board is probed using an edge probe provided in a fixed orientation when the edge of the probe contacts a solder mound of the test point. The solder mound has an elongated shape. A length of the edge is substantially perpendicular to a length of the solder mound when the edge contacts the solder mound and is maintained in the fixed orientation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.