Mounting assembly for packaging and shipping computer components
US8254111B2 · kind B2 · utility
1Cited by
5References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 31, 2010 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Jan 27, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An air duct installed in a chassis is configured to have a heat dissipating device mounted thereon during shipping. The heat dissipating device defining a number of mounting holes corresponding to a number of fixing members extending from a surface of the air duct to accomplish the mounting. Thereby, the heat dissipating device may be conveniently and securely packaged and transported with the air duct and chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.