Microelectromechanical microphone carrier module
US8254619B2 · kind B2 · utility
2Cited by
2References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2010 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Mar 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R19/005
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An MEM microphone carrier module is composed of a substrate and a cover plate. The substrate includes a space layer, a bottom layer, a recession recessed from a top side of the space layer, and a groove formed in the recession. The bottom layer has a metallic plate defining a predetermined pattern and exposed outside a surface thereof. The bottom layer is a single-layer structure formed by the molding of the metallic plate and the insulating glue, such that the substrate is thinner to need lower production cost and take less assembly time than the prior art.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.