System and method for analyzing temperature rise of a printed circuit board
US8255862B2 · kind B2 · utility
1Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2010 |
| Grant date | Aug 28, 2012 |
| Priority date | — |
| Expiry date | Mar 16, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/367
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system and method that can analyze a temperature rise of a printed circuit board (PCB). The system and method receives attribute parameters of the PCB from an input device, and generates a temperature rise formula according to the received attribute parameters. Additionally, the system and method calculates a temperature rise of a local area surrounding each component on the PCB according to the temperature rise formula.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.