Method of forming long strips of dielectric coated metalized film
US8256078B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2010 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | Aug 10, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for forming a plurality of strips to be used for formulating high-breakdown strength and high-temperature capacitors is disclosed. The method includes forming a metalized substrate having a particular pattern, masking a portion of the metalized substrate, coating the metalized substrate with a dielectric material and removing the masking material and thus the dielectric layer from a portion of the metalized layer to form a contact surface. In lieu of placing a masking material on the metalized substrate, the exposed contact area can be formed by shielding a portion of the metalized substrate while depositing the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.