Method for checking and rotating electronic components
US8256109B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2009 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | Feb 20, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53183
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for inspecting and rotating electronic components, particularly flip chips, includes a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. Also a method for inspecting and rotating electronic components, particularly flip chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.