Simulated commercial envelopes and methods of making the same
US8256194B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 27, 2008 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | Oct 5, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D27/14
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
Simulated commercial envelopes and methods of making the same are disclosed. An example envelope includes a first envelope portion having a front panel including a top edge and a bottom edge parallel to the top edge, connected by a pair of side edges. A top flap is integrally formed with the top edge of the front panel about a first fold line and a bottom flap is integrally formed with the bottom edge of the front panel about a second fold line. A second envelope portion having a rear panel is adapted to be secured to the front panel to form a pocket for a mailer insert. The bottom flap foldable about the second fold line and is secured to the rear panel on a side opposite the formed pocket, and the top flap is foldable about the first fold line and is also secured to the rear panel or the bottom flap on the side opposite the formed pocket to form the example envelope.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.