Heat dissipation apparatus having heat pipes inserted therein
US8256498B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 9, 2008 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | Jun 20, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation apparatus includes a heat sink and a pair of first heat pipes. The heat sink includes a pair of first fin assemblies staggered with a pair of second fin assemblies. The first and second fin assemblies each define a receiving groove therein. The second fin assemblies each further defines an opening communicating with the receiving groove of a corresponding second fin assembly. The first heat pipes each include an evaporation section and a condensation section. A portion of the condensation section of each of the first heat pipes is inserted into the receiving groove of each of the first fin assemblies. The other portion of the condensation section of each of the first heat pipes is received in the receiving groove of each of the second fin assemblies through the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.