Substrate for ink ejection heads, ink ejection head, method of manufacturing substrate, and method of manufacturing ink ejection head
US8256878B2 · kind B2 · utility
0Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2009 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | Oct 21, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1645
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A liquid ejection head according to the present invention includes a heat-generating resistor layer, a first electrode layer, an insulating layer extending over the heat-generating resistive layers and the first electrode layer, and a second electrode layer that has a first portion which extending through the insulating layer and which is electrically connected to the first electrode layer and also has a second portion which is not in contact with the insulating layer. The second portion has a space or a piece of resin disposed between the insulating layer and the second electrode layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.