Increasing air inlet/outlet size for electronics chassis
US8257156B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2007 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | May 29, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided are electronics chassis having air inlets with increased cross-sectional area that facilitate airflow through the chassis and thereby provide improved cooling. As electronics chassis are often stacked, it has been determined that the upper surfaces of a lower chassis may be utilized to at least partially define the air inlet of the upper chassis. In this regard, an upper portion of the lower chassis may be removed to increase the size of an air inlet. That is, portions of an upper wall and/or the top wall of a lower chassis are removed and connected by a connecting wall (e.g. a tapered and/or a chamfered wall). Likewise, the bottom wall of an upper chassis may be removed. When stacked, the air inlet of the upper chassis may be disposed above the truncated portion of the lower chassis. In such an arrangement, the size of the resulting air intake is significantly increased.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.