Thermal head manufacturing method
US8257599B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2009 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | Jul 17, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/3359
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
In a thermal head manufacturing method, at least one concave portion is formed on a surface of a first substrate, and a second substrate comprised of a first layer and a second layer that is denser and harder than the first layer is provided. The first and second substrates are bonded to one another so that the second layer of the second substrate covers the concave portion of the first substrate. The first layer of the second substrate is then etched until a surface of the second layer of the second substrate is exposed. At least one heating resistor is formed on the exposed surface of the second layer of the second substrate after the etching step so that the heating resistor is disposed over the concave portion of the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.