Thermosetting resin compositions and articles
US8258216B2 · kind B2 · utility
3Cited by
2References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2010 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | Sep 15, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention generally relates to a resin composition, a cured resin, a sheet-like cured resin, a laminated body, a prepreg, electronic parts, single and multilayer circuit boards comprising a cyanate ester polymer and condensed phosphate ester, for use in single and multilayer circuit boards that are especially useful in the high-frequency range of above 100 MHz.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.