Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module
US8258620B2 · kind B2 · utility
4Cited by
16References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2008 |
| Grant date | Sep 4, 2012 |
| Priority date | — |
| Expiry date | Nov 15, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit device includes an insulating base provided with a resin layer mixed with a fibrous filler, bumps provided in the insulating base and functioning as electrodes for connection, a semiconductor device that is flip-chip mounted, and an underfill filling a gap between the semiconductor device and the insulating base. By allowing the fibrous filler projecting through the top surface of the resin layer to be in contact with the underfill, strength of adhesion between the underfill and the insulating base is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.